By Isabella Kaminski
DuPont Microcircuit Materials (DuPont MCM), part of DuPont Electronics and Communications, has announced a collaboration with the Holst Centre focused on printed electronics.
The partnership is expected to advance technology related to printed structures on flexible substrates, which can be applied to organic photovoltaics as well as flexible displays, RFID, lighting and biomedical technology.
The Holst Centre is a research and development centre in The Netherlands set up by Imec and TNO. DuPont MCM will be joining the Printed Structures on Flexible Substrates programme, which will concentrate on optimising printed metallic structures on flexible substrates in terms of conductivity, fine line deposition and low energy sintering.
A variety of roll-to roll compatible printing techniques will be studied including screen, flexography and ink-jet. Alternative conductor metallurgies will be studied as well as reactive systems for depositing conductive traces.
Erwin Meinders, Printed Structures on Flexible Substrates Programme Manager for the Holst Centre, says: "We are proud to welcome DuPont to the Holst Centre ecosystem. DuPont has a strong reputation in functional inks. I'm confident that DuPont's participation in Holst Centre will give a boost to the further advancement of functional inks and conductive pastes, as key enablers for large-area printed electronics applications.”
DuPont MCM is a supplier of electronic inks and pastes, which are used for forming conductive traces, capacitor and resistor elements, and dielectric and encapsulating layers that are compatible with many substrate surfaces such as polyester, glass and ceramic.
Kerry Adams, European Business Development Manager for DuPont MCM, says: "DuPont MCM is pleased to collaborate with Holst Centre to enhance the potential for significant new material developments and accelerate market growth in multiple printed electronics applications. We are honoured to be part of such an innovative centre of excellence for the advancement of technologies in this exciting area and look forward to collaborative research with other industrial partners.”